微系统集成用倒装芯片工艺技术的发展及趋势
赵雪薇, 阎璐, 邢朝洋, 李男男, 朱政强
Development and Trend of Flip Chip Technology for Microsystem Integration
ZHAO Xue-wei, YAN Lu, XING Chao-yang, LI Nan-nan, ZHU Zheng-qiang
导航与控制
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2019, (5): 11
-21
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DOI: 10.3969/j.issn.1674-5558.2019.05.002
