基于玻璃-硅复合基板的微系统圆片级三维封装
苏兆喜, 邢朝洋, 罗斌, 汪子及, 梁栋国, 尚金堂
Microsystem Wafer-level 3D Packaging Based on Composite Glass-Silicon Substrate
SU Zhao-xi, XING Chao-yang, LUO Bin, WANG Zi-ji, LIANG Dong-guo, SHANG Jin-tang
导航与控制
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2019, (2): 61
-68
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DOI: 10.3969/j.issn.1674-5558.2019.02.010
