高密度CCGA封装振动疲劳可靠性仿真与寿命预测
冯政森, 孙晓冬, 顾林, 曾燕萍, 黎蕾
Vibration Fatigue Reliability Simulation and Life Prediction for High-density CCGA Package
FENG Zheng-sen, SUN Xiao-dong, GU Lin, ZENG Yan-ping, LI Lei
导航与控制
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2022, (3-4): 225
-233
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DOI: 10.3969/j.issn.1674-5558.2022.h3.027
