预置金锡薄膜技术在功率微系统封装中的应用
李林森, 朱喆, 汪涛, 车江波, 崔嵩
Application of Pre-deposited AuSn Thin Film Technology in Power Microsystem Packaging
LI Lin-sen, ZHU Zhe, WANG Tao, CHE Jiang-bo, CUI Song
导航与控制
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2022, (3-4): 157
-165
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DOI: 10.3969/j.issn.1674-5558.2022.h3.019
