基于TSV转接板的三维集成热-力学建模与仿真分析
张桐铨, 吴晓东, 马盛林
Three-dimensional Integration Thermal-mechanical Modeling and Simulation Analysis Based on TSV Interposer
ZHANG Tong-quan, WU Xiao-dong, MA Sheng-lin
导航与控制
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2022, (3-4): 58
-66
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DOI: 10.3969/j.issn.1674-5558.2022.h3.007
