
Methodology for Assessing Hermeticity Reliability in Wafer-level Packaging MEMS Inertial Devices
ZHANG Chenggang, ZHAO Qiancheng, CUI Jian
Navigation and Control ›› 2025, Vol. 24 ›› Issue (3-4) : 51-64.
Methodology for Assessing Hermeticity Reliability in Wafer-level Packaging MEMS Inertial Devices
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