Impact Reliability Analysis of 3D Stacked Packaging under High Acceleration Loads

Impact Reliability Analysis of 3D Stacked Packaging under High Acceleration Loads

LYU Ming-tao, HE Hu

Navigation and Control ›› 2022, Vol. 21 ›› Issue (3-4) : 181-191.

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Navigation and Control ›› 2022, Vol. 21 ›› Issue (3-4) : 181-191. DOI: 10.3969/j.issn.1674-5558.2022.h3.022

Microsystem Album——Reliability Technology

Impact Reliability Analysis of 3D Stacked Packaging under High Acceleration Loads

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 21(3-4): 181-191 https://doi.org/10.3969/j.issn.1674-5558.2022.h3.022

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