Research on Thermal Cycle Reliability of Three-dimensional Integrated Structure Microsystem Based on Finite Element Simulation

doi:10.3969/j.issn.1674-5558.2022.h3.021

XIAO Jin-qing, LI Jun-hui

Navigation and Control ›› 2022, Vol. 21 ›› Issue (3-4) : 174-180.

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Navigation and Control ›› 2022, Vol. 21 ›› Issue (3-4) : 174-180. DOI: 10.3969/j.issn.1674-5558.2022.h3.021

Microsystem Album——Reliability Technology

Research on Thermal Cycle Reliability of Three-dimensional Integrated Structure Microsystem Based on Finite Element Simulation

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 21(3-4): 174-180 https://doi.org/10.3969/j.issn.1674-5558.2022.h3.021

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Received	Published
2022-04-11	2022-08-05
Issue Date
2022-11-07

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