Thermoelectric Coupling Reliability Analysis of GNC Chip Package

Thermoelectric Coupling Reliability Analysis of GNC Chip Package

WU Tian-xiang, LI Jun-hui

Navigation and Control ›› 2022, Vol. 21 ›› Issue (3-4) : 166-173.

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Navigation and Control ›› 2022, Vol. 21 ›› Issue (3-4) : 166-173. DOI: 10.3969/j.issn.1674-5558.2022.h3.020

Microsystem Album——Reliability Technology

Thermoelectric Coupling Reliability Analysis of GNC Chip Package

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 21(3-4): 166-173 https://doi.org/10.3969/j.issn.1674-5558.2022.h3.020

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