Application of Pre-deposited AuSn Thin Film Technology in Power Microsystem Packaging

doi:10.3969/j.issn.1674-5558.2022.h3.019

LI Lin-sen, ZHU Zhe, WANG Tao, CHE Jiang-bo, CUI Song

Navigation and Control ›› 2022, Vol. 21 ›› Issue (3-4) : 157-165.

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Navigation and Control ›› 2022, Vol. 21 ›› Issue (3-4) : 157-165. DOI: 10.3969/j.issn.1674-5558.2022.h3.019

Microsystem Album——Reliability Technology

Application of Pre-deposited AuSn Thin Film Technology in Power Microsystem Packaging

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 21(3-4): 157-165 https://doi.org/10.3969/j.issn.1674-5558.2022.h3.019

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Received	Published
2022-04-11	2022-08-05
Issue Date
2022-11-07

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