Research on Wafer Level Electromechanical Control SiP Technology

LI Ju-qiang, LIAN Yun-he, WANG Meng-ya, GU Lin

Navigation and Control ›› 2022, Vol. 21 ›› Issue (3-4) : 78-84.

PDF(14605 KB)
PDF(14605 KB)
Navigation and Control ›› 2022, Vol. 21 ›› Issue (3-4) : 78-84. DOI: 10.3969/j.issn.1674-5558.2022.h3.009
Microsystem Album——Microsystem Integration Package

Research on Wafer Level Electromechanical Control SiP Technology

    {{javascript:window.custom_author_en_index=0;}}
  • {{article.zuoZhe_EN}}
Author information +
History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 21(3-4): 78-84 https://doi.org/10.3969/j.issn.1674-5558.2022.h3.009

References

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}
PDF(14605 KB)

Accesses

Citation

Detail

Sections
Recommended

/