Three-dimensional Integration Thermal-mechanical Modeling and Simulation Analysis Based on TSV Interposer

doi:10.3969/j.issn.1674-5558.2022.h3.007

ZHANG Tong-quan, WU Xiao-dong, MA Sheng-lin

Navigation and Control ›› 2022, Vol. 21 ›› Issue (3-4) : 58-66.

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Navigation and Control ›› 2022, Vol. 21 ›› Issue (3-4) : 58-66. DOI: 10.3969/j.issn.1674-5558.2022.h3.007

Microsystem Album——Microsystem Modeling and Simulation

Three-dimensional Integration Thermal-mechanical Modeling and Simulation Analysis Based on TSV Interposer

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 21(3-4): 58-66 https://doi.org/10.3969/j.issn.1674-5558.2022.h3.007

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Received	Published
2022-04-10	2022-08-05
Issue Date
2022-11-07

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