Effect of Deposition Parameters on Residual Stress and Microstructure in Magnetron Sputtering Au Thin Films

doi:10.3969/j.issn.1674-5558.2020.06.013

LIU Ming-zhi, LIANG Kang, XIONG Wei, ZHANG Guo-rui, YANG Yang

Navigation and Control ›› 2020, Vol. 19 ›› Issue (6) : 98-104.

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Navigation and Control ›› 2020, Vol. 19 ›› Issue (6) : 98-104. DOI: 10.3969/j.issn.1674-5558.2020.06.013

Testing and Measurement

Effect of Deposition Parameters on Residual Stress and Microstructure in Magnetron Sputtering Au Thin Films

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2020, 19(6): 98-104 https://doi.org/10.3969/j.issn.1674-5558.2020.06.013

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Received	Published
2020-04-28	2020-12-05
Issue Date
2021-03-02

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