Microsystem Wafer-level 3D Packaging Based on Composite Glass-Silicon Substrate

doi:10.3969/j.issn.1674-5558.2019.02.010

SU Zhao-xi, XING Chao-yang, LUO Bin, WANG Zi-ji, LIANG Dong-guo, SHANG Jin-tang

Navigation and Control ›› 2019, Vol. 18 ›› Issue (2) : 61-68.

PDF(2625 KB)

Navigation and Control ›› 2019, Vol. 18 ›› Issue (2) : 61-68. DOI: 10.3969/j.issn.1674-5558.2019.02.010

Microsystem Wafer-level 3D Packaging Based on Composite Glass-Silicon Substrate

{{article.zuoZhe_EN}}

Author information +

History +

HeighLight

Abstract

Key words

QR code of this article

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations

{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2019, 18(2): 61-68 https://doi.org/10.3969/j.issn.1674-5558.2019.02.010

References

Publishing order | Descend order by publishing year | Descend order by cited within

References

Funding

RIGHTS & PERMISSIONS

PDF(2625 KB)

Accesses

Citation

Detail

Sections

Recommended

Received	Published
2019-03-15	2019-04-05
Issue Date
2019-11-27

Please choose a citation manager

Content to export